OPA727, OPA2727

OPA4727, OPA728

SBOS314B − SEPTEMBER 2004 − REVISED DECEMBER 2004

www.ti.com

2

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

Non-Shutdown

OPA727

MSOP-8

DGK

AUE

OPA727

DFN-8

DRB

NSF

OPA2727

DFN-8(2)

DRB

NSD

OPA2727

SO-8

D

OPA2727A

OPA4727(2)

TSSOP-14

PW

OPA4727A

Shutdown

OPA728

MSOP-8

DGK

AUF

OPA728

DFN-8

DRB

NSG

(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this datasheet.

(2) Available Q1’05.

Supply Voltage

+13.2V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Signal Input Terminals, Voltage(2)

−0.5V to (V+) + 0.5V

. . . . . . . . .

Current(2)

±10mA

. . . . . . . . . . . . . . . . . . .

Output Short Circuit(3)

Continuous

. . . . . . . . . . . . . . . . . . . . . . . . .

Operating Temperature

−55

°C to +125°C

. . . . . . . . . . . . . . . . . . . . .

Storage Temperature

−55

°C to +150°C

. . . . . . . . . . . . . . . . . . . . . . .

Junction Temperature

+150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead Temperature (soldering, 10s)

+300

°C

. . . . . . . . . . . . . . . . . . . .

ESD Rating (Human Body Model)

2000V

. . . . . . . . . . . . . . . . . . . .

(Charged Device Model)

1000V

. . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not supported.

(2) Input terminals are diode-clamped to the power-supply rails.

Input signals that can swing more than 0.5V beyond the supply

rails should be current limited to 10mA or less.

(3) Short-circuit to ground, one amplifier per package.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.