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OPA4727 Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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OPA4727 Datasheet(HTML) 2 Page - Burr-Brown (TI) |
2 / 20 page OPA727, OPA2727 OPA4727, OPA728 SBOS314B − SEPTEMBER 2004 − REVISED DECEMBER 2004 www.ti.com 2 PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING Non-Shutdown OPA727 MSOP-8 DGK AUE OPA727 DFN-8 DRB NSF OPA2727 DFN-8(2) DRB NSD OPA2727 SO-8 D OPA2727A OPA4727(2) TSSOP-14 PW OPA4727A Shutdown OPA728 MSOP-8 DGK AUF OPA728 DFN-8 DRB NSG (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this datasheet. (2) Available Q1’05. ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage +13.2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Signal Input Terminals, Voltage(2) −0.5V to (V+) + 0.5V . . . . . . . . . Current(2) ±10mA . . . . . . . . . . . . . . . . . . . Output Short Circuit(3) Continuous . . . . . . . . . . . . . . . . . . . . . . . . . Operating Temperature −55 °C to +125°C . . . . . . . . . . . . . . . . . . . . . Storage Temperature −55 °C to +150°C . . . . . . . . . . . . . . . . . . . . . . . Junction Temperature +150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead Temperature (soldering, 10s) +300 °C . . . . . . . . . . . . . . . . . . . . ESD Rating (Human Body Model) 2000V . . . . . . . . . . . . . . . . . . . . (Charged Device Model) 1000V . . . . . . . . . . . . . . . . . (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
Similar Part No. - OPA4727 |
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Similar Description - OPA4727 |
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