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ISL6253 Datasheet(PDF) 3 Page - Intersil Corporation |
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ISL6253 Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 22 page 3 Absolute Maximum Ratings Thermal Information DCIN, CSIP, DCPRN, ACPRN, CSON to GND . . . . . . -0.3V to +28V CSIP-CSIN, CSOP-CSON . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V CSIP-SGATE, CSIP-BGATE . . . . . . . . . . . . . . . . . . . . . -0.3V to 16V PHASE to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to 28V BOOT to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +35V BOOT-PHASE, VDD-GND, VDDP-PGND . . . . . . . . . . . . -0.3V to 7V ICM, ICOMP, VCOMP . . . . . . . . . . . . . . . . . . . . -0.3V to VDD+0.3V ACSET and DCSET to GND (Note 3) . . . . . . . . -0.8V to VDD+0.3V VDDP, ACLIM, CHLIM, VREF, CELLS. . . . . . . . -0.3V to VDD+0.3V EN, VADJ, PGND to GND . . . . . . . . . . . . . . . . . -0.3V to VDD+0.3V UGATE. . . . . . . . . . . . . . . . . . . . . . . . . PHASE-0.3V to BOOT+0.3V LGATE . . . . . . . . . . . . . . . . . . . . . . . . . . PGND-0.3V to VDDP+0.3V Thermal Resistance θJA (°C/W) θJC (°C/W) QFN Package (Notes 4, 6). . . . . . . . . . 39 9.5 QSOP Package (Note 5) . . . . . . . . . . . 80 NA ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1 Junction Temperature Range. . . . . . . . . . . . . . . . . .-10°C to +150°C Operating Temperature Range . . . . . . . . . . . . . . . .-10°C to +100°C Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Lead Temperature (soldering, 10s).. . . . . . . . . . . . . . . . . . . . +300°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress ratings only and operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. NOTES: 3. When the voltage across ACSET and DCSET is below 0V, the current through ACSET and DCSET should be limited less than 1mA. 4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications DCIN = CSIP = CSIN = 18V, CSOP = CSON = 12V, ACSET = DCSET = 1.5V, VREF = ACLIM = CHLIM, VADJ = Floating, EN = VDD = 5V, BOOT-PHASE = 5.0V, GND = PGND = 0V, CVDD = 1µF IVDD = 0mA, TA = -10°C to +100°C, TJ ≤ 125°C, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS SUPPLY AND BIAS REGULATOR DCIN Input Voltage Range 7 25 V DCIN Quiescent Current EN = VDD, 7V < DCIN < 25V 1.6 4 mA DCIN Quiescent Current in Shutdown mode EN = 0, 7V < DCIN < 25V 1.3 3 mA Battery Leakage Current (Note 5) DCIN = 0, no load 2 10 µA VDD Output Voltage/Regulation 7V < DCIN < 25 V, 0 < IVDD < 30mA 4.925 5.075 5.225 V VDD Undervoltage Lockout Trip Point Rising 4.2 4.4 4.6 V Hysteresis 100 250 400 mV Reference Output Voltage VREF O < IVREF < 300µA 2.365 2.390 2.415 V Battery Charge Voltage Accuracy CSON = 16.8V, CELLS = VDD, VADJ = Float -0.5 0 0.5 % CSON = 12.6V, CELLS = GND, VADJ = Float -0.55 0 0.55 CSON = 8.4V, CELLS = FLOAT, VADJ = Float -0.55 0 0.55 CSON = 17.64V, CELLS = VDD, VADJ = VREF -0.6 0 0.6 CSON = 13.23V, CELLS = GND, VADJ = VREF -0.6 0 0.6 CSON = 8.82V, CELLS = FLOAT, VADJ = VREF -0.6 0 0.6 CSON = 15.96V, CELLS = VDD, VADJ = GND -0.6 0 0.6 CSON = 11.97V, CELLS = GND, VADJ = GND -0.6 0 0.6 CSON = 7.98V, CELLS = FLOAT, VADJ = GND -0.6 0 0.6 TRIP POINTS ACSET Threshold 1.235 1.26 1.285 V ACSET Input Bias Current Hysteresis 2 3.4 4.8 µA ACSET Input Bias Current ACSET > 1.26V 2 3.4 4.8 µA ACSET Input Bias Current ACSET < 1.26V -1 0 1 µA DCSET Threshold 1.235 1.26 1.285 V ISL6253 |
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