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THS7530PWPR Datasheet(PDF) 2 Page - Texas Instruments |
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THS7530PWPR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 16 page THS7530 SLOS405A DECEMBER 2002– REVISED APRIL 2003 www.ti.com 2 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGING/ORDERING INFORMATION PRODUCT PACKAGE PACKAGE DESIGNATOR SYMBOL TEMPERATURE RANGE, TA ORDERING NUMBER TRANSPORT MEDIA THS7530 TSSOP PowerPAD PWP 14 THS7530 40 °Cto85°C THS7530PWP Tube THS7530 TSSOP PowerPAD PWP-14 THS7530 –40 °C to 85°C THS7530PWPR Tape and reel ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) THS7530 Supply voltage, VS+ – Vs– 5.5 V Input voltage, VI ±VS Output current, IO (2) 65 mA Differential input voltage, VID ±4 V Continuous power dissipation See Dissipation Rating Table Maximum junction temperature, TJ 150 °C Maximum junction temperature for long term stability, TJ 125 °C Operating free-air temperature range, TA –40 °C to 85°C Storage temperature range, Tstg –65 °C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C HBM 3000 V ESD CDM 1500 V ESD MM 200 V (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The THS7530 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the PowerPAD thermally enhanced package. RECOMMENDED OPERATING CONDITIONS TEST CONDITIONS MIN TYP MAX UNIT Supply voltage, [VS– to VS+] 4.5 5 5.5 V Operating free–air temperature, TA –40 85 °C Input common mode voltage [VS– to VS+] = 5 V 2.5 V Output common mode voltage [VS– to VS+] = 5 V 2.5 V PACKAGE THERMAL DATA PACKAGE PCB ΘJA ( C/W) ΘJC ( C/W) TA = 25°C POWER RATING 14PWP See Layout Considerations in the application section of this data sheet. 37.5 2.07 3 W PowerPAD is a trademark of Texas Instruments. |
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