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VFC1206

Vishay Foil Resistors

Document Number: 63084

Revision 03-Jul-02

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FEATURES

• Nominal TCR: 0.5ppm/

°C (- 55°C to + 125°C)

• Resistance Range: 10

Ω to 30K

• Tolerance: to

± 0.01%

• Load Life Stability:

± 0.01% maximum ∆R under full rated

power at + 70

°C for 2000 hours

• Shelf Life Stability: 50ppm (0.005%) over several years

• Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V)

• Current Noise: < 0.010

µV (rms)/volt of applied voltage

• Non Inductive: < 0.08

µH

TABLE 1 - RESISTANCE VALUE VS

TOLERANCE AND TCR

VALUE

STANDARD

MAXIMUM

Ω

TOLERANCE (%)*

TCR**

100

Ω to 30K

± 0.01%

± 2.0ppm/°C

50

Ω to < 100Ω± 0.05

± 3.0ppm/°C

25

Ω to < 50Ω± 0.1

± 4.0ppm/°C

10

Ω to < 25Ω± 0.25

± 5.0ppm/°C

TEST

MIL-PRF-55342

VFC1206

CHARACTERISTIC E MAXIMUM

Temperature Coefficient of

± 25ppm/°C

See Table 1

Resistance

Thermal Shock

± 0.10%

± 0.02%

Low Temperature Operation

± 0.10%

± 0.02%

Short Time Overload

± 0.10%

± 0.02%

High Temperature Exposure

± 0.10%

± 0.03%

Resistance to Bonding

± 0.20%

± 0.02%

Moisture Resistance

± 0.20%

± 0.03%

Life 2000hrs at + 70

± 0.50%

± 0.01%

TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS

NOTES:

* As shown + 0.01

Ω to allow for measurement error.

** As shown + 0.01

Ω to allow for measurement error for values less

than 100

Ω.

High Precision Flip Chip,

Patents Pending (Industrialized Countries)

*Tighter tolerances are available.

Please contact Application

Engineering.

**Range: - 55

°C to + 125°C, + 25°C reference

- 50

- 25

0

+ 25

+ 50

+ 75

+ 100

+ 125

+ 150

+ 100

+ 50

0

- 50

- 100

- 150

- 200

∆R

R

(PPM)

Ambient Temperature (

FIGURE 1 - NOMINAL TCR

COMPARISON OF Z FOIL TO C FOIL

- 55

The TCR for values < 100

Ω are influenced by the termination

composition and result in a deviation from this curve.

< 0.5PPM/

°C

Z Alloy

C Alloy 2PPM/

Z Alloy 0.5PPM/

< 2PPM/

°C

C Alloy

The VFC1206 is a surface mountable flip chip resistor that

utilizes Ultra Precision Bulk Metal

from other Vishay Bulk Metal

as much as it is installed with the foil side facing the PCB

providing better power handling capabilities.

The Foil

element is isolated from the PCB by a protective overcoating.

This overcoating plus the overall product design isolates the

resistor from handling and installation stresses.

The temperature coefficient of resistance (TCR) curve shown

below compares the new revolutionary “Z” Foil with its TCR of

< 0.5ppm/

Foil characteristics of excellent long term stability, low noise

and availability of tight tolerance are maintained in this Flip

Chip configuration. The VFC1206 is available in any value

within the specified resistance range. The flip chip configuration

is more economical for high volume, anolog applications where

high precision is required.

Product may not

be to scale