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TPS54973PWP Datasheet(PDF) 2 Page - Texas Instruments |
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TPS54973PWP Datasheet(HTML) 2 Page - Texas Instruments |
2 / 10 page TPS54973 SLVS453A − FEBRUARY 2003 − REVISED FEBRUARY 2005 www.ti.com 2 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA OUTPUT VOLTAGE PACKAGE PART NUMBER −40°C to 85°C 0.9 V to 2.5 V Plastic HTSSOP (PWP)(1) TPS54973PWP (1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54973PWPR). See the application section of the data sheet for PowerPAD drawing and layout information. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) TPS54973 VIN −0.3 V to 4.5 V SS/ENA, SYNC −0.3 V to 7 V Input voltage range, VI RT −0.3 V to 6 V Input voltage range, VI VSENSE −0.3 V to 4V BOOT −0.3 V to 10 V Output voltage range V VBIAS, COMP, PWRGD −0.3 V to 7 V Output voltage range, VO PH −0.6 V to 6 V Source current I PH Internally limited Source current, IO COMP, VBIAS 6 mA PH 16 A Sink current, IS COMP 6 mA Sink current, IS SS/ENA, PWRGD 10 mA Voltage differential AGND to PGND ±0.3 V Operating virtual junction temperature range, TJ −40°C to 125°C Storage temperature, Tstg −65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300°C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Input voltage, VI 3 4 V Operating junction temperature, TJ −40 125 °C DISSIPATION RATINGS(1)(2) PACKAGE THERMAL IMPEDANCE JUNCTION-TO-AMBIENT TA =25°C POWER RATING TA = 70°C POWER RATING TA = 85°C POWER RATING 28 Pin PWP with solder 14.4 °C/W 6.94 W(3) 3.81 W 2.77 W 28 Pin PWP without solder 27.9 °C/W 3.58 W 1.97 W 1.43 W (1) For more information on the PWP package, refer to TI technical brief, literature number SLMA002. (2) Test board conditions: 1. 3” x 3”, 4 layers, thickness: 0.062” 2. 1.5 oz. copper traces located on the top of the PCB 3. 1.5 oz. copper ground plane on the bottom of the PCB 4. 0.5 oz. copper ground planes on the two internal layers 5. 12 thermal vias (see “Recommended Land Pattern” in applications section of this data sheet) (3) Maximum power dissipation may be limited by over current protection. |
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