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TLV3012AIDCKR Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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TLV3012AIDCKR Datasheet(HTML) 2 Page - Burr-Brown (TI) |
2 / 13 page TLV3011, TLV3012 SBOS300B 2 www.ti.com Supply Voltage .................................................................................... +7V Signal Input Terminals, Voltage(2) ........................... –0.5V to (V+) + 0.5V Current(2) .................................................. ±10mA Output Short-Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –55 °C to +150°C Storage Temperature ..................................................... –55 °C to +150°C Junction Temperature .................................................................... +150 °C Lead Temperature (soldering, 10s) ............................................... +300 °C ESD Rating (Human Body Model) .................................................. 2000V NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. In put signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground. PIN CONFIGURATIONS ABSOLUTE MAXIMUM RATINGS(1) Top View NOTE: Pin 1 is determined by orienting package marking as shown. For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. PACKAGE/ORDERING INFORMATION ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 1 2 3 6 5 4 OUT V − IN+ V+ REF IN − SOT23-6 TLV3011AIDBV 1 2 3 6 5 4 OUT V − IN+ V+ REF IN − SOT23-6 TLV3012AIDBV 1 2 3 6 5 4 V+ REF IN − OUT V − IN+ SC70-6 TLV3011AIDCK 1 2 3 6 5 4 V+ REF IN − OUT V − IN+ SC70-6 TLV3012AIDCK |
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