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IDT79R4700-200-GH Datasheet(PDF) 8 Page - Integrated Device Technology |
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IDT79R4700-200-GH Datasheet(HTML) 8 Page - Integrated Device Technology |
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8 / 25 page  8 of 25 April 10, 2001 IDT79R4700 Thermal Considerations Thermal Considerations Thermal Considerations Thermal Considerations The RC4700 uses special packaging techniques to improve the thermal properties of high-speed processors. The RC4700 is packaged using cavity down packaging in a 179-pin PGA package, and a 208-lead QFP package. These packages effectively dissipate the power of the CPU, increasing device reliability. The R4700 is guaranteed in a case temperature range of 0 ° to +85° C. The type of package, speed (power) of the device, and airflow condi- tions affect the equivalent ambient temperature conditions that will meet this specification. The equivalent allowable ambient temperature, TA, can be calculated using the thermal resistance from case to ambient ( ∅CA) of the given package. The following equation relates ambient and case tempera- tures: TA = TC - P * ∅CA where P is the maximum power consumption at hot temperature, calculated by using the maximum ICC specification for the device. Typical values for ∅CA at various airflows are shown in Table 2:. Revision History Revision History Revision History Revision History Revision History Revision History Revision History Revision History January 1996: Initial draft. March 1997: Deleted data on 150MHz speed for 5V part only. August 1997: Upgraded 80 to 175 MHz speed specs from “Prelimi- nary” to “Final.” June 1999: Upgraded speed to 200MHz on 3V part specs. Package change to DP. June 29, 2000: Added back 175 and 200 MHz speeds. April 10, 2001: In the Data Output category of the System Interface Parameters tables, changed values in the Min column for all speeds from 1.0 to 0. ∅CA Airflow (ft/min) 0 200 400 600 800 1000 PGA 16 7 5 3 2.5 2 QFP 21 13 10 9 8 7 Table 2: Thermal Resistance ( ∅CA) at Various Airflows |
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