12/07/01

Appendix to Mini Flat Pack FPD-AAS/A1

TEMPERATURE PROFILE OF SOLDERING REFLOW

(1) One time soldering reflow is recommended within the condition of temperature and time profile

shown below.

30 seconds

1 minute

2 minutes

1.5 minutes

1 minute

25 C

180 C

200 C

230 C

(2) When using another soldering method such as infrated ray lamp, the temperature may rise

partially in the mold of the device.

Keep the temperature on the package of the device within the condition of above (1).