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AA0402JK-13100RL Datasheet(PDF) 7 Page - YAGEO Corporation |
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AA0402JK-13100RL Datasheet(HTML) 7 Page - YAGEO Corporation |
7 / 10 page Chip Resistor Surface Mount www.yageo.com Dec. 08, 2015 V.3 Product specification 7 10 SERIES AA 0201 to 2512 T TE ES ST TS S A AN ND D R RE EQ QU UIIR RE EM ME EN NT TS S TEST TEST METHOD PROCEDURE REQUIREMENTS High Temperature Exposure AEC-Q200 Test 3 MIL-STD-202 Method 108 1,000 hours at TA = 155 °C, unpowered ± (1.0%+0.05Ω) <50 mΩ for Jumper Moisture Resistance AEC-Q200 Test 6 MIL-STD-202 Method 106 Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d. with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts ± (0.5%+0.05Ω) for D/F tol. ± (2.0%+0.05Ω) for J tol. <100 mΩ for Jumper Biased Humidity AEC-Q200 Test 7 MIL-STD-202 Method 103 1,000 hours; 85 °C / 85% RH 10% of operating power Measurement at 24± 4 hours after test conclusion. ± (3.0%+0.05Ω) <100 mΩ for Jumper Operational Life AEC-Q200 Test 8 MIL-STD-202 Method 108 1,000 hours at 125 °C, derated voltage applied for 1.5 hours on, 0.5 hour off, still-air required ± (1.0%+0.05Ω) <100 mΩ for Jumper Resistance to Soldering Heat AEC-Q200 Test 15 MIL-STD-202 Method 210 Condition B, no pre-heat of samples Lead-free solder, 260± 5 °C, 10± 1 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ± (0.5%+0.05Ω) for D/F tol. ± (1.0%+0.05Ω) for J tol. <50 mΩ for Jumper No visible damage Thermal Shock AEC-Q200 Test 16 MIL-STD-202 Method 107 -55/+125 °C Number of cycles is 300. Devices mounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air ± (1.0%+0.05Ω) <50 mΩ for Jumper ESD AEC-Q200 Test 17 AEC-Q200-002 1 pos. + 1 neg. discharges 0201: 500V 0402/0603: 1KV 0805 and above: 2KV ± (3.0%+0.05Ω) <50 mΩ for Jumper Table 4 Test condition, procedure and requirements |
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