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TUSB546A-DCI Datasheet(PDF) 5 Page - Texas Instruments |
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TUSB546A-DCI Datasheet(HTML) 5 Page - Texas Instruments |
5 / 49 page 5 TUSB546A-DCI www.ti.com SLLSF14 – JUNE 2017 Product Folder Links: TUSB546A-DCI Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the GND terminals. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply Voltage Range(2), VCC –0.3 4 V Voltage Range at any input or output pin Differential voltage between positive and negative inputs ±2.5 V Voltage at differential inputs –0.5 VCC + 0.5 V CMOS Inputs –0.5 VCC + 0.5 V Maximum junction temperature, TJ 125 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±5000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Main power supply 3 3.3 3.6 V Supply Ramp Requirement 100 ms V(12C) Supply that external resistors are pulled up to on SDA and SCL 1.7 3.6 V V(PSN) Supply Noise on VCC pins 100 mV TA Operating free-air temperature TUSB546A-DCI 0 70 °C TUSB546I-DCI –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TUSB546A-DCI UNIT RNQ (WQFN) 40 PINS RθJA Junction-to-ambient thermal resistance 37.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 20.7 °C/W RθJB Junction-to-board thermal resistance 9.5 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 9.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.3 °C/W |
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