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TPS6209733-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS6209733-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 20 page 4 TPS62097-Q1 SLVSDZ7 – AUGUST 2017 www.ti.com Product Folder Links: TPS62097-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) While switching. 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT Voltage at Pins(2) AVIN, PVIN, EN, VOS, PG –0.3 6.0 V MODE, SS/TR, SW (DC) –0.3 VIN+0.3V FB –0.3 3.0 SW (AC, less than 100ns)(3) -3 11 Sink current PG 0 1.0 mA Temperature Operating Junction, TJ -40 150 °C Storage, Tstg –65 150 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT VESD Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2500 V Charged-device model (CDM), per AEC Q100-011(1) ±1500 6.3 Recommend Operating Conditions MIN MAX UNIT VIN Input voltage range 2.5 6.0 V VPG Pull-up resistor voltage 0 6.0 V VOUT Output voltage range 0.8 VIN V IOUT Output current range 0 2.0 A TJ Operating junction temperature -40 125 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953 6.4 Thermal Information THERMAL METRIC(1) TPS62097-Q1WRGT (16 TERMINALS) UNITS RθJA Junction-to-ambient thermal resistance 44.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 51.7 °C/W RθJB Junction-to-board thermal resistance 19.3 °C/W ψJT Junction-to-top characterization parameter 1.1 °C/W ψJB Junction-to-board characterization parameter 19.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 3.6 °C/W |
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