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TPS6209733-Q1 Datasheet(PDF) 4 Page - Texas Instruments

Part # TPS6209733-Q1
Description  2-A High Efficiency Step-Down Converter in Wettable Flanks QFN Package
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS6209733-Q1 Datasheet(HTML) 4 Page - Texas Instruments

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TPS62097-Q1
SLVSDZ7 – AUGUST 2017
www.ti.com
Product Folder Links: TPS62097-Q1
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Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
While switching.
6 Specifications
6.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
Voltage at Pins(2)
AVIN, PVIN, EN, VOS, PG
–0.3
6.0
V
MODE, SS/TR, SW (DC)
–0.3
VIN+0.3V
FB
–0.3
3.0
SW (AC, less than 100ns)(3)
-3
11
Sink current
PG
0
1.0
mA
Temperature
Operating Junction, TJ
-40
150
°C
Storage, Tstg
–65
150
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.2 ESD Ratings
VALUE
UNIT
VESD
Electrostatic
discharge
Human-body model (HBM), per AEC Q100-002(1)
±2500
V
Charged-device model (CDM), per AEC Q100-011(1)
±1500
6.3 Recommend Operating Conditions
MIN
MAX
UNIT
VIN
Input voltage range
2.5
6.0
V
VPG
Pull-up resistor voltage
0
6.0
V
VOUT
Output voltage range
0.8
VIN
V
IOUT
Output current range
0
2.0
A
TJ
Operating junction temperature
-40
125
°C
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
6.4 Thermal Information
THERMAL METRIC(1)
TPS62097-Q1WRGT
(16 TERMINALS)
UNITS
RθJA
Junction-to-ambient thermal resistance
44.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
51.7
°C/W
RθJB
Junction-to-board thermal resistance
19.3
°C/W
ψJT
Junction-to-top characterization parameter
1.1
°C/W
ψJB
Junction-to-board characterization parameter
19.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
3.6
°C/W


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