Electronic Components Datasheet Search |
|
TLV70228QDDCRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
|
|
TLV70228QDDCRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page TLV702-Q1 SLVSC35B – AUGUST 2013 – REVISED JUNE 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT IN –0.3 6 V Voltage(2) EN –0.3 6 V OUT –0.3 6 V Current (source) OUT Internally limited A Output short-circuit duration Indefinite Operating virtual junction, TJ –55 150 °C Temperature Storage, Tstg –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Q100-011 ±750 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN 2 5.5 V VOUT 1.2 4.8 V IOUT 0 300 mA Ambient temperature, TA –40 125 °C Operating virtual junction temperature, TJ –40 125 °C 6.4 Thermal Information TLV702-Q1 THERMAL METRIC(1) DDC (SOT) DSE (WSON) UNIT 5 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 262.8 321.3 RθJC(top) Junction-to-case (top) thermal resistance 68.2 207.9 RθJB Junction-to-board thermal resistance 81.6 281.5 °C/W ψJT Junction-to-top characterization parameter 1.1 42.4 ψJB Junction-to-board characterization parameter 80.9 284.8 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 142.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TLV702-Q1 |
Similar Part No. - TLV70228QDDCRQ1 |
|
Similar Description - TLV70228QDDCRQ1 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |