2004-02-11

Page 2

SDP04S60, SDD04S60

SDT04S60

Final data

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - case

-

-

4.1

K/W

Thermal resistance, junction - ambient, leaded

-

-

62

SMD version, device on PCB:

P-TO263-3-2: @ min. footprint

P-TO252-3-1: @ min. footprint

-

-

-

-

-

35

-

-

62

-

75

50

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Diode forward voltage

-

-

1.7

2

1.9

2.4

V

Reverse current

-

-

15

40

200

1000

µA

IN = 30%

2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.