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TLIN2029DRBRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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TLIN2029DRBRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 39 page 4 TLIN2029-Q1 SLLSEY6 – OCTOBER 2017 www.ti.com Product Folder Links: TLIN2029-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) Tested in accordance to AEC-Q100-002 (3) Test method based upon AEC-Q100-002, LIN bus and VSUP are stressed with respect to GND. (4) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) Pins TXD, RXD, EN (2) ±4000 V Pins LIN bus, Vsup(3) ±8000 Charged-device model (CDM), per JEDEC specification JESD22-C101(4) All pins ±1500 (1) IEC 61000-4-2 is a system level ESD test. Results given here are specific to the IBEE LIN EMC Test specification conditions. Different system level configurations may lead to different results (2) Testing performed at 3rd party IBEE Zwickau test house, test report available upon request. (3) ISO7637 is a system level transient test. Results given here are specific to the IBEE LIN EMC Test specification conditions. Different system level configurations may lead to different results. (4) SAEJ2962-1 Testing performed at 3rd party US3 approved EMC test facility, test report available upon request. 6.3 ESD Ratings, IEC Specification VALUE UNIT IEC 61000-4-2 according to IBEE EMC test spec(1) LIN , Vsup terminal to GND(2) ±8000 V ISO7637-2 & IEC 62215-3 Transients according to IBEE LIN EMC test spec(3) LIN , Vsup Pulse 1 -100 V Pulse 2 75 V Pulse 3a -150 V Pulse 3b 100 V Powered ESD Performance SAEJ2962-1 SAEJ2962-1(4) Contact ±8000 V Air Discharge ±25000 V 6.4 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VSUP Supply boltage 4 48 V VLIN LIN bus input voltage 0 48 V VLOGIC Logic pin voltage (RXD, TXD, EN) 0 5.25 V TA Operational free-air temperature (see Thermal Information table) –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Thermal Information THERMAL METRIC(1) TLIN2029-Q1 UNIT D DRB 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 115.5 48.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 58.7 55.5 °C/W RθJB Junction-to-board thermal resistance 58.9 22.2 °C/W ψJT Junction-to-top characterization parameter 14.1 1.2 °C/W ψJB Junction-to-board characterization parameter 58.2 22.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 4.8 °C/W |
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