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TLIN2029-Q1

SLLSEY6 – OCTOBER 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

Tested in accordance to AEC-Q100-002

(3)

(4)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per

±4000

V

±8000

Charged-device model (CDM), per JEDEC

All pins

±1500

(1)

IEC 61000-4-2 is a system level ESD test. Results given here are specific to the IBEE LIN EMC Test specification conditions. Different

system level configurations may lead to different results

(2)

Testing performed at 3rd party IBEE Zwickau test house, test report available upon request.

(3)

ISO7637 is a system level transient test. Results given here are specific to the IBEE LIN EMC Test specification conditions. Different

system level configurations may lead to different results.

(4)

SAEJ2962-1 Testing performed at 3rd party US3 approved EMC test facility, test report available upon request.

6.3 ESD Ratings, IEC Specification

VALUE

UNIT

IEC 61000-4-2 according to IBEE EMC test

±8000

V

ISO7637-2 & IEC 62215-3 Transients

LIN , Vsup

Pulse 1

-100

V

Pulse 2

75

V

Pulse 3a

-150

V

Pulse 3b

100

V

Powered ESD Performance SAEJ2962-1

Contact

±8000

V

Air Discharge

±25000

V

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply boltage

4

48

V

LIN bus input voltage

0

48

V

Logic pin voltage (RXD, TXD, EN)

0

5.25

V

Operational free-air temperature (see Thermal Information table)

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information

TLIN2029-Q1

UNIT

D

DRB

8 PINS

8 PINS

Junction-to-ambient thermal resistance

115.5

48.5

°C/W

Junction-to-case (top) thermal resistance

58.7

55.5

°C/W

Junction-to-board thermal resistance

58.9

22.2

°C/W

Junction-to-top characterization parameter

14.1

1.2

°C/W

Junction-to-board characterization parameter

58.2

22.2

°C/W

Junction-to-case (bottom) thermal resistance

n/a

4.8

°C/W