1

RXD

8

NC

2

EN

7

VSUP

3

NC

6

LIN

4

TXD

5

GND

Not to scale

Thermal

Pad

1

RXD

8

NC

2

EN

7

VSUP

3

NC

6

LIN

4

TXD

5

GND

Not to scale

3

TLIN2029-Q1

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5 Pin Configuration and Functions

D Package

8-Pin (SOIC)

Top View

DRB Package

8-Pin (VSON)

Top View

Pin Functions

PIN

Type

DESCRIPTION

NO.

NAME

1

RXD

D O

RXD output (open-drain) interface reporting state of LIN bus voltage

2

EN

D I

Enable input - High put the device in normal operation mode and low put the device in sleep

mode

3

NC

–

Not connected

4

TXD

D I

TXD input interface to control state of LIN output - Internal pulled to ground

5

GND

GND

Ground

6

LIN

HV I/O

LIN bus single-wire transmitter and receiver

7

Supply

Device supply voltage (connected to battery in series with external reverse blocking diode

8

NC

–

Not connected

DRB Thermal

Pad

GND

GND

Ground and should be soldered

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage range (ISO/DIS 17987)

–0.3

60

V

LIN Bus input voltage (ISO/DIS 17987)

–58

58

V

Logic Pin Voltage (RXD, TXD, EN)

–0.3

5.5

V

Junction temperature range

–55

150

°C

Storage temperature range

–65

165