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QPA2705EVB01 Datasheet(PDF) 7 Page - TriQuint Semiconductor |
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QPA2705EVB01 Datasheet(HTML) 7 Page - TriQuint Semiconductor |
7 / 12 page QPA2705 5 W, 28 V, 2.5 – 2.7 GHz GaN PA Module Rev. B - 7 of 12 - www.qorvo.com Pin Configuration and Description Pin No. Label Description 1 VD1 Driver Amplifier, Drain Bias 4 VG1 Driver Amplifier, Gate Bias 6 RF IN RF Input 11 VG3 Carrier Amplifier, Gate Bias 16 VD3 Carrier Amplifier, Drain Bias 19 RF OUT RF Output 27 VD2 Peaking Amplifier, Drain Bias 32 VG2 Peaking Amplifier, Gate Bias 2-3, 5, 7-10, 12-15, 17-18, 20-26, 28-31, 33-36 GND Internal Grounding, recommend connecting to Epad ground EPAD GND DC/RF Ground. Must be soldered to EVB ground plane over array of vias for thermal and RF performance. Solder voids under EPAD will result in excessive junction temperatures causing permanent damage. |
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