Molded Guide

www.vishay.com

Vishay Sprague

Revision: 12-Sep-17

6

Document Number: 40074

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

RECOMMENDED REFLOW PROFILES

Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles.

PROFILE FEATURE

SnPb EUTECTIC ASSEMBLY

LEAD (Pb)-FREE ASSEMBLY

Preheat / soak

100 °C

150 °C

150 °C

200 °C

60 s to 120 s

60 s to 120 s

Ramp-up

3 °C/s max.

3 °C/s max.

183 °C

217 °C

60 s to 150 s

60 s to 150 s

Depends on case size - see table below

20 s

30 s

Time 25 °C to peak temperature

6 min max.

8 min max.

Ramp-down

6 °C/s max.

6 °C/s max.

25

TIME (s)

t

s

t

L

Time 25 °C to peak

T

L

T

p

T

t

p

T

s max.

T

s min.

Preheat area

Max. ramp-up rate = 3 °C/s

Max. ramp-down rate = 6 °C/s

CASE CODE

SnPb EUTECTIC PROCESS

LEAD (Pb)-FREE PROCESS

A, B, C, V

235 °C

260 °C

D, E, W

220 °C

250 °C

PAD DIMENSIONS in inches [millimeters]

CASE CODE

A

(MIN.)

B

(NOM.)

C

(NOM.)

D

(NOM.)

MOLDED CHIP CAPACITORS, ALL TYPES

A

0.071 [1.80]

0.067 [1.70]

0.053 [1.35]

0.187 [4.75]

B

0.118 [3.00]

0.071 [1.80]

0.065 [1.65]

0.207 [5.25]

C

0.118 [3.00]

0.094 [2.40]

0.118 [3.00]

0.307 [7.80]

D

0.157 [4.00]

0.098 [2.50]

0.150 [3.80]

0.346 [8.80]

E

0.157 [4.00]

0.098 [2.50]

0.150 [3.80]

0.346 [8.80]

V

0.157 [4.00]

0.098 [2.50]

0.150 [3.80]

0.346 [8.80]

W

0.185 [4.70]

0.098 [2.50]

0.150 [3.80]

0.346 [8.80]

A

B

C

D