PRELIMINARY

QPL6216

High-Linearity SDARS LNA

Data Sheet REV E

Subject to change without notice

7 of 8

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®

PCB Mounting Pattern

NOTES:

1. All dimensions are in millimeters. Angles are in degrees.

2. Use 1 oz. copper minimum for top and bottom layer metal.

3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We

recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm

(0.10”).

4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.