1/4

www.asb.co.kr

September 2017

High OIP3

Medium Power Amplifier Module

Parameter

Unit

Specifications

Min

Typ

Max

Frequency Range

MHz

380

420

Gain

dB

18

19

Gain Flatness

dB

0.7

0.8

Noise Figure

dB

10

11

dBm

44

46

dB

-10/-12

Output P1dB

dBm

32

33

sec

-

Supply Current

mA

600

700

Supply Voltage

V

5.4

Impedance



50

Package Type & Size

mm

Surface Mount Type, 13Wx13Lx3.8H

Operating temperature is

–40

C to +85 C.

1) OIP3 is measured with two tones at an output power of 18 dBm/tone separated by 1 MHz.

2) S11, S22 (max) is the worst value within the frequency band.

Pin Number

Function

3

RF In

8

RF Out

10

Vs

Others

Ground

Features

Note: 1. The number and size of ground via holes in

a circuit board is critical for thermal RF

grounding considerations.

2. We recommend that the ground via holes be

placed on the bottom of all ground pins for

better RF and thermal performance, as

shown in the drawing at the left side.

Description

·

= 18.3 dB@420 MHz

·

NF of 10.0 dB over Frequency

·

Unconditionally Stable

·

Single 5.4 V Supply

·

High OIP3@Low Current

Website: www.asb.co.kr

E-mail: sales@asb.co.kr

Tel: (82) 42-528-7223

Fax: (82) 42-528-7222

More Information

Typ.@T = 25

Specifications (in Production)

APM0400-P33

ASB Inc.

Solder Stencil Area

Ø

0.3 plated thru holes to ground plane

plerow

(Top View)

(Bottom View)

(Side View)

2 x Ø 2.0 plated thru holes to screw on heat sinker

(Recommended Footprint)

Outline Drawing (Unit: mm)

APM0400-P33 is an internally matched amplifier mini-

module for such application band in SMD package

with the output P1dB of 33 dBm. It is compactly de-

signed for low current consumption and high OIP3.

Integrating all the components for biasing and match-

ing within the module enhances production yield and

throughput as well. It passes through the stringent

DC, RF, and reliability tests. Not sample test but 100%

quality control test is made before packing.

1-stage Single Type