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BUK7606-75B Datasheet(PDF) 4 Page - NXP Semiconductors |
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BUK7606-75B Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 15 page Philips Semiconductors BUK75/7606-75B TrenchMOS™ standard level FET Product data Rev. 02 — 20 September 2002 4 of 15 9397 750 10278 © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 4. Thermal characteristics 4.1 Transient thermal impedance Table 3: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base Figure 4 - - 0.5 K/W Rth(j-a) thermal resistance from junction to ambient SOT78 vertical in still air - 60 - K/W SOT404 mounted on a printed circuit board; minimum footprint - 50 - K/W Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration. 03ng88 single shot 0.2 0.1 0.05 0.02 10-3 10-2 10-1 1 10-6 10-5 10-4 10-3 10-2 10-1 1 tp (s) Zth(j-mb) (K/W) δ = 0.5 tp tp T P t T δ = |
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