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NG80960JA-33 Datasheet(PDF) 3 Page - Intel Corporation

Part # NG80960JA-33
Description  EMBEDDED 32-BIT MICROPROCESSOR
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

NG80960JA-33 Datasheet(HTML) 3 Page - Intel Corporation

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Advance Information Datasheet
3
80960JA/JF/JD/JT 3.3 V Microprocessor
Contents
1.0
Introduction ..................................................................................................................7
2.0
80960Jx Overview ......................................................................................................7
2.1
80960 Processor Core .......................................................................................... 9
2.2
Burst Bus............................................................................................................. 10
2.3
Timer Unit............................................................................................................ 10
2.4
Priority Interrupt Controller .................................................................................. 10
2.5
Instruction Set Summary ..................................................................................... 11
2.6
Faults and Debugging ......................................................................................... 11
2.7
Low Power Operation.......................................................................................... 11
2.8
Test Features ...................................................................................................... 12
2.9
Memory-Mapped Control Registers .................................................................... 12
2.10
Data Types and Memory Addressing Modes ...................................................... 12
3.0
Package Information...............................................................................................14
3.1
Pin Descriptions .................................................................................................. 16
3.1.1
Functional Pin Definitions....................................................................... 16
3.1.2
80960Jx 132-Lead PGA Pinout.............................................................. 22
3.1.3
80960Jx 132-Lead PQFP Pinout............................................................ 26
3.1.4
80960Jx 196-Ball MPBGA Pinout .......................................................... 29
3.2
Package Thermal Specifications ......................................................................... 34
3.3
Thermal Management Accessories..................................................................... 38
3.3.1
Heatsinks................................................................................................ 38
4.0
Electrical Specifications........................................................................................39
4.1
Absolute Maximum Ratings................................................................................. 39
4.2
Operating Conditions........................................................................................... 39
4.3
Connection Recommendations ........................................................................... 40
4.4
VCC5 Pin Requirements (VDIFF) ....................................................................... 40
4.5
VCCPLL Pin Requirements................................................................................. 41
4.6
DC Specifications ................................................................................................ 42
4.7
AC Specifications ................................................................................................ 44
4.7.1
AC Test Conditions and Derating Curves .............................................. 47
4.7.2
AC Timing Waveforms ........................................................................... 52
5.0
Bus Functional Waveforms..................................................................................58
5.1
Basic Bus States ................................................................................................. 68
5.2
Boundary-Scan Register ..................................................................................... 69
6.0
Device Identification ...............................................................................................74
7.0
Revision History .......................................................................................................77


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