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AD9434-500EBZ Datasheet(PDF) 9 Page - Analog Devices |
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AD9434-500EBZ Datasheet(HTML) 9 Page - Analog Devices |
9 / 29 page AD9434 Data Sheet Rev. B | Page 8 of 28 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating Electrical AVDD to AGND −0.3 V to +2.0 V DRVDD to DRGND −0.3 V to +2.0 V AGND to DRGND −0.3 V to +0.3 V AVDD to DRVDD −2.0 V to +2.0 V D0+/D0− Through D11+/D11− to DRGND −0.3 V to DRVDD + 0.2 V DCO+, DCO− to DRGND −0.3 V to DRVDD + 0.2 V OR+, OR− to DRGND −0.3 V to DRVDD + 0.2 V CLK+ to AGND −0.3 V to AVDD + 0.2 V CLK− to AGND −0.3 V to AVDD + 0.2 V VIN+ to AGND −0.3 V to AVDD + 0.4 V VIN− to AGND −0.3 V to AVDD + 0.4 V CML to AGND −0.3 V to AVDD + 0.2 V VREF to AGND −0.3 V to AVDD + 0.2 V SDIO to DRGND −0.3 V to DRVDD + 0.2 V PDWN to AGND −0.3 V to DRVDD + 0.2 V CSB to AGND −0.3 V to DRVDD + 0.2 V SCLK/DFS to AGND −0.3 V to DRVDD + 0.2 V Environmental Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering, 10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the PCB increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 6. Package Type θJA θJC Unit 56-Lead LFCSP_VQ (CP-56-5) 23.7 1.7 °C/W Typical θJA and θJC are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. ESD CAUTION |
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