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DF101 Datasheet(PDF) 1 Page - Chip Integration Technology Corporation |
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DF101 Datasheet(HTML) 1 Page - Chip Integration Technology Corporation |
1 / 3 page 1 Dimensions in inches and (millimeters) Features ■ ■ Mechanical data ■ Maximum ratings and electrical characteristics Rating at 25 ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. OC Outline ■ Recommended for non-automatic applications. Ideal for & save space on printed circuit board. Applicable for automatic insertion. Reliable low cost construction utilizing molded plastic technology results in inexpensive product. Glass passivated chip junctions. Suffix "G" indicates Halogen-free part, ex.DF101G. Lead-free parts meet RoHS requirments. • • • • • • • • Surge overload ratings to 30 amperes peak. DF • Case : Molded plastic, DF • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 • Polarity : marked on body • Mounting Position : Any • Weight : Approximated 0.38 gram • Epoxy:UL94-V0 rated flame retardant DF101 THRU DF107 1A Miniature Glass Passivated Single-Phase Bridge Rectifiers Operating temperature O T ( C) J -55 ~ +150 Max. forward voltage O @0.5A, T = 25 C A V (V) F Max. DC blocking voltage V (V) R Max. RMS voltage V (V) RMS 70 140 280 35 420 560 Max. repetitive peak reverse voltage V (V) RRM 100 200 400 50 600 800 Marking code DF102 DF103 DF104 DF101 DF105 DF106 Symbol DBL102 DBL103 DBL104 DBL101 DBL105 DBL106 100 200 400 50 600 800 1.05 700 1000 DF107 DBL107 1000 Document ID : DS-21B25 Issued Date : 2010/05/05 Revised Date : 2012/05/31 Revision : C .256(6.5) .094(2.4) .185(4.69) .350(8.9) .205(5.2) .335(8.51) .244(6.2) .091(2.3) .150(3.81) .299(7.6) .197(5.0) .320(8.13) .080(2.03) .050(1.27) + ~ ~ - .023(0.58) .018(0.46) .013(0.33) .009(0.22) I O I FSM I R Forward rectified current Forward surge current Reverse current Parameter O at TA = 25 C 8.3ms single half sine-wave superimposed on rate load (JEDEC method) O V = V T = 25 C R RRM A O V = V T = 125 C R RRM A Conditions Symbol MIN. TYP. MAX. UNIT 500 10 1.0 30 A A uA T STG Storage temperature -55 +150 OC 2 I t Current squared time 3.7 2 A S R θJA Thermal resistance 68 OC/W O t < 8.3ms, T = 25 C J junction to ambient |
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