NCV1009

http://onsemi.com

3

MAXIMUM RATINGS*

Rating

Value

Unit

Reverse Current

20

mA

Forward

10

mA

Package Thermal Resistance, SO−8:

45

165

°C/W

°C/W

Operating Temperature Range

−40 to +125

°C

Storage Temperature Range

−65 to +150

°C

Lead Temperature Soldering:

Wave Solder (through hole styles only) (Note 1)

Reflow: (SMD styles only) (Notes 2, 3)

260 peak

240 peak

°C

°C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. 10 second maximum

2. 60 second maximum above 183

°C.

3. −5

°C / +0°C allowable conditions.

*The maximum package power dissipation must be observed.

Characteristic

Test Conditions

Min

Typ

Max

Unit

Reverse Breakdown Voltage

2.492

2.500

2.508

V

Reverse Breakdown Voltage

0

2.492

2.500

2.508

V

Reverse Breakdown Voltage

−40

2.480

2.500

2.508

V

Reverse Breakdown Voltage

Change with Current

400

{

−

−

2.6

3.0

5.0

6.0

mV

mV

Reverse Dynamic Impedance

{

−

−

0.2

0.4

1.0

1.4

Ω

Ω

Temperature Stability

Average Temperature Coefficient

0

0

−

−

1.8

15

−

−

mV

ppm/

°C

Long Term Stabilty

−

20

−

ppm/kHr

†

Denotes the specifications which apply over full operating temperature range.

4. Average temperature coefficient is defined as the total voltage change divided by the specified temperature range.

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 3. Reverse Current vs. Reverse Voltage

Figure 4. Change in Reverse Voltage vs.

Reverse Current

0.5

1.0

1.4

1.8

2.2

2.6

0

4

812

16

20

REVERSE VOLTAGE (V)

0

1

2

3

4

5

REVERSE CURRENT (mA)