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ALN2503AT Datasheet(PDF) 1 Page - Advanced Semiconductor Business Inc.

Part # ALN2503AT
Description  Internally Matched LNA Module
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Manufacturer  ASB [Advanced Semiconductor Business Inc.]
Direct Link  http://www.asb.co.kr
Logo ASB - Advanced Semiconductor Business Inc.

ALN2503AT Datasheet(HTML) 1 Page - Advanced Semiconductor Business Inc.

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www.asb.co.kr
July 2017
plerowTM ALN2503AT
Internally Matched LNA Module
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Parameter
Unit
Specifications
Min
Typ
Max
Frequency Range
MHz
2300
2700
Gain
dB
12.5
13.5
Gain Flatness
dB
 0.7
 0.9
Noise Figure
dB
0.7
0.75
Output IP3 (1)
dBm
31
32
S11 / S22 (2)
dB
-11/ -8
Output P1dB
dBm
16
17
Switching Time
sec
1
Supply Current
mA
40
60
Supply Voltage
V
5
Impedance
50
Package Type & Size
mm
Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40
C to +85C.
1) OIP3 is measured with two tones at an output power of 0 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Pin Number
Function
2
RF In
5
RF Out
6
+Vcc
Others
Ground
Outline Drawing (Unit: mm)
Features
·
S21 = 14.2 dB @ 2300 MHz
= 12.8 dB @ 2700 MHz
·
NF of 0.7 dB over Frequency
·
Unconditionally Stable
·
Single 5V Supply
·
High OIP3 @ Low Current
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Description
(Recommended Footprint)
ALN2503AT
ASB Inc.
(Top View)
(Bottom View)
Ø
0.4 plated thru holes to ground plane
plerow
(Side View)
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
More Information
1-stage Single Type
Typ. @ T = 25
C, Vs = 5 V, Freq. = 2500 MHz, Zo.sys = 50 ohm
Solder Stencil Area
Specifications (in Production)


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