CY7C1370CV25
CY7C1372CV25
Document #: 38-05235 Rev. *C
Page 8 of 27
(DQa,b,c,d/DQPa,b,c,d for CY7C1370CV25 and DQa,b/DQPa,b
for CY7C1372CV25) inputs. Doing so will three-state the
output drivers. As a safety precaution, DQ and DQP (DQa,b,c,d/
DQPa,b,c,d for CY7C1370CV25 and DQa,b/DQPa,b for
CY7C1372CV25) are automatically three-stated during the
data portion of a write cycle, regardless of the state of OE.
Burst Write Accesses
The CY7C1370CV25/CY7C1372CV25 has an on-chip burst
counter that allows the user the ability to supply a single
address and conduct up to four WRITE operations without
reasserting the address inputs. ADV/LD must be driven LOW
in order to load the initial address, as described in the Single
Write Access section above. When ADV/LD is driven HIGH on
the subsequent clock rise, the chip enables (CE1, CE2, and
CE3) and WE inputs are ignored and the burst counter is incre-
mented. The correct BW (BWa,b,c,d for CY7C1370CV25 and
BWa,b for CY7C1372CV25) inputs must be driven in each
cycle of the burst write in order to write the correct bytes of
data.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ
places the SRAM in a power conservation “sleep” mode. Two
clock cycles are required to enter into or exit from this “sleep”
mode. While in this mode, data integrity is guaranteed.
Accesses pending when entering the “sleep” mode are not
considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the “sleep” mode. CE1, CE2, and CE3, must remain inactive
for the duration of tZZREC after the ZZ input returns LOW.
Interleaved Burst Address Table
(MODE = Floating or VDD)
First
Address
Second
Address
Third
Address
Fourth
Address
A1,A0
A1,A0
A1,A0
A1,A0
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
Linear Burst Address Table (MODE = GND)
First
Address
Second
Address
Third
Address
Fourth
Address
A1,A0
A1,A0
A1,A0
A1,A0
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
ZZ Mode Electrical Characteristics
Parameter
Description
Test Conditions
Min.
Max
Unit
IDDZZ
Snooze mode standby current
ZZ
> VDD − 0.2V
60
mA
tZZS
Device operation to ZZ
ZZ
> VDD − 0.2V
2tCYC
ns
tZZREC
ZZ recovery time
ZZ
< 0.2V
2tCYC
ns
tZZI
ZZ active to snooze current
This parameter is sampled
2tCYC
ns
tRZZI
ZZ Inactive to exit snooze current
This parameter is sampled
0
ns
Truth Table[1, 2, 3, 4, 5, 6, 7]
Operation
Address
Used
CE
ZZ
ADV/LD
WE
BWx
OE
CEN
CLK
DQ
Deselect Cycle
None
H
L
L
X
X
X
L
L-H
Three-State
Continue Deselect Cycle
None
X
L
H
X
X
X
L
L-H
Three-State
Read Cycle (Begin Burst)
External
L
L
L
H
X
L
L
L-H Data Out (Q)
Read Cycle (Continue Burst)
Next
X
L
H
X
X
L
L
L-H Data Out (Q)
NOP/Dummy Read (Begin Burst)
External
L
L
L
H
X
H
L
L-H
Three-State
Dummy Read (Continue Burst)
Next
X
L
H
X
X
H
L
L-H
Three-State
Write Cycle (Begin Burst)
External
L
L
L
L
L
X
L
L-H
Data In (D)
Write Cycle (Continue Burst)
Next
X
L
H
X
L
X
L
L-H
Data In (D)
NOP/WRITE ABORT (Begin Burst)
None
L
L
L
L
H
X
L
L-H
Three-State
WRITE ABORT (Continue Burst)
Next
X
L
H
X
H
X
L
L-H
Three-State
IGNORE CLOCK EDGE (Stall)
Current
X
L
X
X
X
X
H
L-H
–
SNOOZE MODE
None
X
H
X
X
X
X
X
X
Three-State
Notes:
1. X = “Don't Care”, 1 = Logic HIGH, 0 = Logic LOW, CE stands for ALL Chip Enables active. BWx = 0 signifies at least one Byte Write Select is active, BWx = Valid
signifies that the desired byte write selects are asserted, see Write Cycle Description table for details.
2. Write is defined by WE and BW[a:d]. See Write Cycle Description table for details.
3. When a write cycle is detected, all I/Os are tri-stated, even during byte writes.
4. The DQ and DQP pins are controlled by the current cycle and the OE signal.
5. CEN = H inserts wait states.
6. Device will power-up deselected and the I/Os in a tri-state condition, regardless of OE.
7. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles.During a read cycle DQs and DQP[a:d] = Three-state when
OE is inactive or when the device is deselected, and DQs=data when OE is active.