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EL2228CY-T7 Datasheet(PDF) 10 Page - Intersil Corporation |
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EL2228CY-T7 Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 10 page 10 All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com application does not come at the expense of stability. As seen in the typical performance curves, the EL2228 in a gain of only 1 exhibited 0.5dB of peaking with a 500 Ω load. Output Drive Capability The EL2228 is designed to drive a low impedance load. It can easily drive 6VP-P signal into a 500Ω load. This high output drive capability makes the EL2228 an ideal choice for RF, IF, and video applications. Furthermore, the EL2228 is current-limited at the output, allowing it to withstand momentary short to ground. However, the power dissipation with output-shorted cannot exceed the power dissipation capability of the package. Driving Cables and Capacitive Loads Although the EL2228 is designed to drive low impedance load, capacitive loads will decreases the amplifier's phase margin. As shown in the performance curves, capacitive load can result in peaking, overshoot and possible oscillation. For optimum AC performance, capacitive loads should be reduced as much as possible or isolated with a series resistor between 5 Ω to 20Ω. When driving coaxial cables, double termination is always recommended for reflection- free performance. When properly terminated, the capacitance of the coaxial cable will not add to the capacitive load seen by the amplifier. Power Dissipation With the wide power supply range and large output drive capability of the EL2228, it is possible to exceed the 150°C maximum junction temperatures under certain load and power-supply conditions. It is therefore important to calculate the maximum junction temperature (TJMAX) for all applications to determine if power supply voltages, load conditions, or package type need to be modified for the EL2228 to remain in the safe operating area. These parameters are related as follows: T JMAX T MAX θ JAxPDMAXTOTAL () + = where: •PDMAXTOTAL is the sum of the maximum power dissipation of each amplifier in the package (PDMAX) •PDMAX for each amplifier can be calculated as follows: PD MAX 2*V S I SMAX V S ( - V OUTMAX ) V OUTMAX R L ---------------------------- × + × = where: •TMAX = Maximum ambient temperature • θJA = Thermal resistance of the package •PDMAX = Maximum power dissipation of 1 amplifier •VS = Supply voltage •IMAX = Maximum supply current of 1 amplifier •VOUTMAX = Maximum output voltage swing of the application •RL = Load resistance Power Supply Bypassing And Printed Circuit Board Layout As with any high frequency devices, good printed circuit board layout is essential for optimum performance. Ground plane construction is highly recommended. Pin lengths should be kept as short as possible. The power supply pins must be closely bypassed to reduce the risk of oscillation. The combination of a 4.7µF tantalum capacitor in parallel with 0.1µF ceramic capacitor has been proven to work well when placed at each supply pin. For single supply operation, where pin 4 (VS-) is connected to the ground plane, a single 4.7µF tantalum capacitor in parallel with a 0.1µF ceramic capacitor across pin 8 (VS+). For good AC performance, parasitic capacitance should be kept to a minimum. Ground plane construction again should be used. Small chip resistors are recommended to minimize series inductance. Use of sockets should be avoided since they add parasitic inductance and capacitance which will result in additional peaking and overshoot. EL2228 |
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