CY62136V MoBL®
Document #: 38-05087 Rev. *B
Page 3 of 11
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage to Ground Potential ............... –0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State[4] ....................................–0.5V to VCC + 0.5V
DC Input Voltage[4].................................–0.5V to VCC + 0.5V
Output Current into Outputs (LOW)............................ 20 mA
Static Discharge Voltage........................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current..................................................... > 200 mA
Operating Range
Range
Ambient Tempera-
ture[TA]
[6]
VCC
Industrial
−40°C to +85°C
2.7V to 3.6V
Automotive
−40°C to +125°C
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
CY62136V-55
CY62136V-70
Unit
Min. Typ.[2] Max. Min. Typ.[2] Max.
VOH
Output HIGH
Voltage
IOH = −1.0 mA
VCC = 2.7V
2.4
2.4
V
VOL
Output LOW Voltage IOL = 2.1 mA
VCC = 2.7V
0.4
0.4
V
VIH
Input HIGH Voltage
VCC = 3.6V
2.2
VCC+
0.5V
2.2
VCC+
0.5V
V
VIL
Input LOW Voltage
VCC = 2.7V
–0.5
0.8
–0.5
0.8
V
IIX
Input Load Current
GND < VI < VCC
Industrial
–1
+1
–1
+1
µA
Automotive
–10
+10
µA
IOZ
Output Leakage
Current
GND < VO < VCC,
Output Disabled
Industrial
–1
+1
–1
+1
µA
Automotive
–10
+10
µA
ICC
VCC Operating
Supply
Current
f = fMAX = 1/tRC,VCC = 3.6V,
IOUT = 0 mA,
CMOS
Levels
Industrial
7
20
7
15
mA
Automotive
7
20
mA
f = 1 MHz,
1
2
1
2
mA
ISB1
Automatic CE
Power-down
Current— CMOS
Inputs
CE > VCC−0.3V,
VIN > VCC−0.3V or
VIN < 0.3V, f = fMAX
100
100
µA
ISB2
Automatic CE
Power-down
Current— CMOS
Inputs
CE > VCC−0.3V
VIN > VCC−0.3V or
VIN < 0.3V, f = 0
VCC = 3.6V Industrial(LL)
1
15
1
15
µA
Industrial(SL)
1
5
1
5
µA
Automotive
1
20
µA
Thermal Resistance
Parameter
Description
Test Conditions
TSOPII
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)[5]
Still Air, soldered on a 4.25 x 1.125 inch, 4-layer
printed circuit board
60
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)[5]
22
°C/W
Capacitance[5]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VCC= VCC(typ)
6pF
COUT
Output Capacitance
8
pF
Notes:
4. VIL(min) = –2.0V for pulse durations less than 20 ns.
5. Tested initially and after any design or process changes that may affect these parameters.
6. TA is the “Instant-On” case temperature.
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