[Data Sheet]

Stress strength according to

he mounting position:

A＞B＞C＞D

so please pay attention to the touch on product.

We recommend the soldering pattern that shows on the right.

It will be different according to mounting situation of circuit board,

therefore, please concern before designing.

※The product has adopted the electrode structure that it should solder

with back electrode of the product.

Thus, please be informed that the shape of electrode pin of

solder fillet formation is not guaranteed.

The through hole on electrode surface is for conduction of front

　and rear electrodes but not for formation of solder fillet.

４-２-２. Mini Package (Smaller than 1608 size)

・Vibration may result in low mounting rate since it will cause the static electricity of product and

adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of

・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering

with other parts within the usage limitation after open the moistureproof package.

・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions,

it may cause the discoloration of the resin.

　one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility

・The product is not guaranteed for flow soldering.

・Thermal stress during the flow soldering of surrounding parts will influence the reliability of LED and

please evaluate the soldering conditions before using it. Also please make sure the expiration date

・Please set appropriate reflow temperature based on our product usage conditions and specification.

[SML-D15x(C) series]

４．Mounting

４－１. Soldering

４－２. Automatic Mounting

４-２-１. Silicon Resin Sealing Product

The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress

directly on the sealing section.

４－５．Soldering Pattern for Recommendation

finally has bad influence on the productʼs reliability.

・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin

to prevent electrostatic charge.

expansion and moisture absorption at humidity will cause heat stress during soldering process and

the mounter to control the product stabilization. In addition, it is recommended to set ionizer

・For our product that has no solder resist, because of its solder amount and soldering conditions,

that will influence its reliability.Therefore, please be informed, concerning it before using it.

after opening the moistureproof package.

４－３. Mounting Location

The stress like bending stress of circuit board dividing after mounting, may cause LED package crack

or damage of LED internal junction, therefore, please concern the mounting direction and position

to avoid bending or screwing with great stress of the circuit board.

４―４. Mechanical Stress after Mounting

The mechanical stress may damage the LED after Circuit Mounting,

0.8mm

0.85mm

0.8mm

0.8mm

PCB Bonding Direction

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