iC-WKM

M-TYPE CW LASER DIODE DRIVER

Rev C2, Page 3/12

PACKAGING INFORMATION SO8-TP, DFN10 4 mm x 4 mm to JEDEC standard

PIN CONFIGURATION SO8-TP

1

2

3

4

5

6

7

8

<A-CODE>

<P-CODE>

<P-CODE>

PIN FUNCTIONS

No. Name Function

1 CI

Capacitor for Power Control

2 GND

Ground

3 AGND Reference Ground for CI, RM

4 MDK

Monitor Input 2

(MD Cathode, modulation)

5 MDA

APC Setup, Monitor Input 1

(MD Anode)

6 VCCA Driver Supply

7 VCC

+3.6 to 15 V Supply Voltage

8 LDA

Driver Output (LD Anode)

The Thermal Pad is to be connected to a Ground Plane on the PCB. Do not short-circuit pins AGND and GND, for

this may deteriorate the precision of the regulator and interfere with the soft-start!

PIN CONFIGURATION DFN10 4 mm x 4 mm

6

7

8

9

10

2

5

4

3

1

<D-CODE>

<A-CODE>

<P-CODE>

PIN FUNCTIONS

No. Name Function

1 CI

Capacitor for Power Control

2 GND

Ground

3 AGND Reference Ground for CI, RM

4 MDK

Monitor Input 2

(MD Cathode, modulation)

5 n.c.

6 MDA

APC Setup, Monitor Input 1

(MD Anode)

7 VCCA Driver Supply

8 VCC

+3.6 to 15 V Supply Voltage

9 LDA

Driver Output (LD Anode)

10 n.c.

The Thermal Pad is to be connected to a Ground Plane on the PCB. Do not short-circuit pins AGND and GND, for

this may deteriorate the precision of the regulator and interfere with the soft-start!