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RT9833B-24GY Datasheet(PDF) 10 Page - Richtek Technology Corporation |
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RT9833B-24GY Datasheet(HTML) 10 Page - Richtek Technology Corporation |
10 / 11 page RT9833 10 DS9833-00 May 2013 www.richtek.com © Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. Application Information Multiple Supplies Mainly, the pull-up connected to the RT9833 will connect to the supply voltage that is being monitored at the IC's VCC pin. However, some systems may use the open- drain output to level-shift from the monitored supply to reset circuitry powered by some other supply. Benefits of Highly Accurate Reset Threshold Most μP supervisor ICs have reset threshold voltages between 1% and 1.5% below the value of nominal supply voltages. This ensures a reset will not occur within 1% of the nominal supply, but will occur when the supply is 1.5% below nominal. Thermal Considerations For continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula : PD(MAX) = (TJ(MAX) − TA) / θJA where TJ(MAX) is the maximum junction temperature, TAis the ambient temperature, and θJAis the junction to ambient thermal resistance. For recommended operating condition specifications, the maximum junction temperature is 125 °C. The junction to ambient thermal resistance, θJA, is layout dependent. SC-82 package, the thermal resistance, θJA, is 345.6°C/ W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at TA = 25 °C can be calculated by the following formula : PD(MAX) = (125 °C − 25°C) / (345.6°C/W) = 0.29W for SC-82 package The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, θJA. The derating curve in Figure 1 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. Figure 1. Derating Curve of Maximum Power Dissipation 0.0 0.1 0.2 0.3 0.4 0.5 0 25 50 75 100 125 Ambient Temperature (°C) Four-Layer PCB |
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