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ASF153 Datasheet(PDF) 10 Page - Advanced Semiconductor Business Inc. |
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ASF153 Datasheet(HTML) 10 Page - Advanced Semiconductor Business Inc. |
10 / 11 page 10/11 ASB Inc. sales@asb.co.kr February 2017 ASF153 5. Package Outline (SOT89, 4.5x4.0x1.5 mm) 6. Surface Mount Recommendation (In mm) Symbols Dimensions (In mm) MIN NOM MAX A 1.40 1.50 1.60 L 0.89 1.04 1.20 b 0.36 0.42 0.48 b1 0.41 0.47 0.53 C 0.38 0.40 0.43 D 4.40 4.50 4.60 D1 1.40 1.60 1.75 E 3.64 --- 4.25 E1 2.40 2.50 2.60 e1 2.90 3.00 3.10 H 0.35 0.40 0.45 S 0.65 0.75 0.85 e 1.40 1.50 1.60 ASF153 Pxxxx Lot No. Part No. NOTE 1. The number and size of ground via holes in a circuit board are critical for thermal and RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of the lead pin 2 and exposed pad of the device for better RF and thermal performance, as shown in the drawing at the left side. |
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