HIGH-WITHSTAND VOLTAGE LOW CURRENT CONSUMPTION LOW DROPOUT CMOS VOLTAGE REGULATOR

S-1142C/D Series

7

Power dissipation of HSOP-6 (reference)

Package power dissipation differs depending on the mounting conditions.

The power dissipation characteristics under the following test conditions should be taken as reference values

only.

[Mounted board]

(1) Board size:

50 mm

× 50 mm × t1.6 mm

(2) Board material: Glass epoxy resin (two layers)

(3) Wiring ratio:

90%

(4) Test conditions: When mounted on board (wind speed: 0 m/s)

(5) Land pattern:

Refer to the recommended land pattern (drawing code: FH006-A-L-SD)

0

50

100

150

2400

1600

0

Ambient temperature (Ta) [

°C]

800

2000

1200

400

Figure 4 Power Dissipation of Package (When Mounted on Board)

Table 6

Condition

Power Dissipation (Reference)

Thermal Resistance Value (

θj − a)

HSOP-6 (When mounted on board)

2000 mW

50°C/W