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THS3092 Datasheet(PDF) 2 Page - Texas Instruments |
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THS3092 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 34 page www.ti.com 1 2 3 4 8 7 6 5 1VOUT 1VIN − 1VIN + VS− VS+ 2VOUT 2VIN− 2VIN+ D, DDA TOP VIEW THS3092 NC = No Internal Connection D, PWP TOP VIEW 1 2 3 4 5 6 7 14 13 12 11 10 9 8 1VOUT 1VIN− 1VIN+ VS− VS+ 2VOUT 2VIN− 2VIN+ NC = No Internal Connection THS3096 See Note A. NC REF NC NC PD NC Note A: The devices with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF pin functional range is from VS− to (VS+ − 4 V). DISSIPATION RATING TABLE THS3092 THS3096 SLOS428A – DECEMBER 2003 – REVISED FEBRUARY 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION PART NUMBER PACKAGE TYPE TRANSPORT MEDIA, QUANTITY THS3092D Rails, 75 SOIC-8 THS3092DR Tape and Reel, 2500 THS3092DDA Rails, 75 SOIC-8-PP(1) THS3092DDAR Tape and Reel, 2500 Power-down THS3096D Rails, 75 SOIC-8 THS3096DR Tape and Reel, 2500 THS3096PWP Rails, 90 TSSOP-14-PP(1) THS3096PWPR Tape and Reel, 2000 (1) The PowerPAD is electrically isolated from all other pins. POWER RATING(2) PACKAGE Θ JC (°C/W) Θ JA (°C/W) (1) TA≤ 25°C TA = 85°C D-8 38.3 97.5 1.02 W 410 mW DDA-8(3) 9.2 45.8 2.18 W 873 mW PWP-14(3) 2.07 37.5 2.67 W 1.07 W (1) This data was taken using the JEDEC standard High-K test PCB. (2) Power rating is determined with a junction temperature of 125 °C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125 °C for best performance and long term reliability. (3) The THS3092 and THS3096 may incorporate a PowerPAD™ on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD™ thermally enhanced package. 2 |
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