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SN74LVC1G386DCKR Datasheet(PDF) 1 Page - Texas Instruments

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Part # SN74LVC1G386DCKR
Description  SINGLE 3-INPUT POSITIVE-XOR GATE
Download  12 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC1G386DCKR Datasheet(HTML) 1 Page - Texas Instruments

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FEATURES
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
A
GND
B
C
VCC
Y
3
2
1
4
5
6
B
GND
A
Y
VCC
C
YEP OR YZP PACKAGE
(BOTTOM VIEW)
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G386
SINGLE 3-INPUT POSITIVE-XOR GATE
SCES439C – APRIL 2003 – REVISED APRIL 2005
Available in the Texas Instruments
NanoStar ™ and NanoFree™
Packages
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
The SN74LVC1G386 performs the Boolean function Y = A
⊕ B ⊕ C in positive logic.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
SN74LVC1G386YEPR
0.23-mm Large Bump – YEP
Tape and reel
_ _ _C8_
NanoFree™ – WCSP (DSBGA)
SN74LVC1G386YZPR
–40
°C to 85°C 0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Tape and reel
SN74LVC1G386DBVR
CC6_
SOT (SC-70) – DCK
Tape and reel
SN74LVC1G386DCKR
C8_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
⋅ = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUT
Y
A
B
C
L
L
L
L
L
L
H
H
L
H
L
H
L
H
H
L
H
L
L
H
H
L
H
L
H
H
L
L
H
H
H
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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