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ZSSC3218BI1B Datasheet(PDF) 1 Page - Integrated Device Technology |
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ZSSC3218BI1B Datasheet(HTML) 1 Page - Integrated Device Technology |
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1 / 55 page  High-End 18-Bit Sensor Signal Conditioner ZSSC3218 Datasheet © 2016 Integrated Device Technology, Inc. 1 April 20, 2016 Brief Description The ZSSC3218 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential or pseudo-differential input signal. Designed for high- resolution sensor module applications, the ZSSC3218 can perform offset, span, and 1 st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge or absolute voltage sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected sensor values are provided at the digital output pins, which can be configured as I 2C™* ( ≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via a 26-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Pro- gramming the ZSSC3218 is simple via the serial interface. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3218 provides accelerated signal processing, increased resolution, and improved noise immunity in order to support high-speed control, safety, and real-time sensing applications with the highest requirements for energy efficiency. Features • Flexible, programmable analog front-end design; up to 18-bit analog-to-digital converter (ADC) • Fully programmable gain amplifier for optimizing sensor signals: gain range 6.6 to 216 (linear) • Internal auto-compensated temperature sensor • Digital compensation of individual sensor offset; 1 st and 2nd order digital compensation of sensor gain as well as 1 st and 2nd order temperature gain and offset drift • Programmable interrupt operation • High-speed sensing: e.g. 16-bit conditioned sensor signal measurement rate >500s -1 • Typical sensor elements can achieve an accu- racy of better than ±0.10% FSO** at -40 to 85°C Benefits • Integrated 26-bit calibration math digital signal processor (DSP) • Fully corrected signal at digital output • Layout customized for die-die bonding with sensor for high-density chip-on-board assembly • One-pass calibration minimizes calibration costs • No external trimming, filter, or buffering com- ponents required • Highly integrated CMOS design • Integrated reprogrammable non-volatile memory • Excellent for low-voltage and low-power battery applications • Optimized for operation in calibrated resistive (e.g., pressure) sensor or calibrated absolute voltage (e.g., thermopile) sensor modules Physical Characteristics • Supply voltage range: 1.68V to 3.6V • Current consumption: 1.0mA (operating mode) • Sleep State current: 20nA (typical) • Temperature resolution: <0.003K/LSB • Best-in-class energy-efficiency: with 16-bit resolution: <140pJ/step with 18-bit resolution: <50pJ/step • Operation temperature: –40°C to +85°C • Small die size • Delivery options: die for wafer bonding * I 2C™ is a trademark of NXP. ** FSO = Full Scale Output. ZSSC3218 Application Example VSSB VDD INN VDDB VSS EOC RES MOSI SDA SCLK SCL sensor element VDDB VSSB INP(+) INN(-) INP MISO SS Stacked-Die Sensor Module VDD VSS Microcontroller VDD VSS SS MISO MOSI SDA SCLK SCL Battery ZSSC3218 RES EOC |
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