MJE13009Z9 datasheet(6/6 Pages) FOSHAN

Part #	MJE13009Z9

Description	Silicon NPN Transistor in a TO-3P Plastic Package

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Manufacturer	FOSHAN [Foshan Blue Rocket Electronics Co.,Ltd.]

Direct Link	http://www.fsbrec.com/

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6 / 6 page

MJE13009Z9

Rev.E Mar.-2016

DATA SHEET

http://www.fsbrec.com

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波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free)

说明：

Note:

1

、预热温度 25～150℃，时间 60～90sec;

1.Preheating:25~150

℃, Time:60~90sec.

2

、峰值温度 255±5℃，时间持续为 5±0.5sec;

2.Peak Temp.:255

±5℃, Duration:5±0.5sec.

3

、焊接制程冷却速度为 2～10℃/sec.

3. Cooling Speed: 2~10

℃/sec.

耐焊接热试验条件 /

Resistance to Soldering Heat Test Conditions

温度：270±5℃

时间：10±1 sec.

Temp.:270±5℃

Time:10±1 sec

包装规格 / Packaging SPEC.

套管包装 / TUBE

Package Type

封装形式

Units 包装数量

Dimension 包装尺寸 (unit：mm

3)

Units/Tube

只

/套管

Tubes/Inner Box

套管

/盒

Units/Inner Box

只

/盒

Inner Boxes/Outer Box

盒

/箱

Units/Outer Box

只

/箱

Tube 套管

Inner Box 盒

Outer Box 箱

TO-3P

30

15

450

5

2250

497.5×46×8

555×164×50

575×290×180

使用说明 / Notices

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