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OPA189, OPA2189, OPA4189

SBOS830 – JUNE 2017

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Product Folder Links: OPA189 OPA2189 OPA4189

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Copyright © 2017, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information: OPA189

OPA189

UNIT

D (SOIC)

DGK (VSSOP)

DBV (SOT)

8 PINS

8 PINS

5 PINS

Junction-to-ambient thermal resistance

136

143

205

°C/W

Junction-to-case (top) thermal resistance

74

47

200

°C/W

Junction-to-board thermal resistance

62

64

113

°C/W

Junction-to-top characterization parameter

19.7

5.3

38.2

°C/W

Junction-to-board characterization parameter

54.8

62.8

104.9

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: OPA2189

OPA2189

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

136

143

°C/W

Junction-to-case (top) thermal resistance

74

47

°C/W

Junction-to-board thermal resistance

62

64

°C/W

Junction-to-top characterization parameter

19.7

5.3

°C/W

Junction-to-board characterization parameter

54.8

62.8

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.6 Thermal Information: OPA4189

OPA4189

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

86

93

°C/W

Junction-to-case (top) thermal resistance

46

28

°C/W

Junction-to-board thermal resistance

41

34

°C/W

Junction-to-top characterization parameter

11.3

1.9

°C/W

Junction-to-board characterization parameter

40.7

33.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W