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OPA2189IDR Datasheet(PDF) 8 Page - Texas Instruments |
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OPA2189IDR Datasheet(HTML) 8 Page - Texas Instruments |
8 / 36 page 8 OPA189, OPA2189, OPA4189 SBOS830 – JUNE 2017 www.ti.com Product Folder Links: OPA189 OPA2189 OPA4189 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information: OPA189 THERMAL METRIC(1) OPA189 UNIT D (SOIC) DGK (VSSOP) DBV (SOT) 8 PINS 8 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 136 143 205 °C/W RθJC(top) Junction-to-case (top) thermal resistance 74 47 200 °C/W RθJB Junction-to-board thermal resistance 62 64 113 °C/W ΨJT Junction-to-top characterization parameter 19.7 5.3 38.2 °C/W ΨJB Junction-to-board characterization parameter 54.8 62.8 104.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Thermal Information: OPA2189 THERMAL METRIC(1) OPA2189 UNIT D (SOIC) DGK (VSSOP) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 136 143 °C/W RθJC(top) Junction-to-case (top) thermal resistance 74 47 °C/W RθJB Junction-to-board thermal resistance 62 64 °C/W ΨJT Junction-to-top characterization parameter 19.7 5.3 °C/W ΨJB Junction-to-board characterization parameter 54.8 62.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.6 Thermal Information: OPA4189 THERMAL METRIC(1) OPA4189 UNIT D (SOIC) PW (TSSOP) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 86 93 °C/W RθJC(top) Junction-to-case (top) thermal resistance 46 28 °C/W RθJB Junction-to-board thermal resistance 41 34 °C/W ΨJT Junction-to-top characterization parameter 11.3 1.9 °C/W ΨJB Junction-to-board characterization parameter 40.7 33.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W |
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