MJD253 datasheet(6/6 Pages) FOSHAN

Part #	MJD253

Description	Silicon PNP transistor in a TO-252 Plastic Package.

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Manufacturer	FOSHAN [Foshan Blue Rocket Electronics Co.,Ltd.]

Direct Link	http://www.fsbrec.com/

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6 / 6 page

MJD253

Rev.E May.-2016

DATA SHEET

http://www.fsbrec.com

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回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free)

说明：

Note:

1

、预热温度 25～150℃，时间 60～90sec;

1.Preheating:25~150

℃, Time:60~90sec.

2

、峰值温度 245±5℃，时间持续为 5±0.5sec;

2.Peak Temp.:245

±5℃, Duration:5±0.5sec.

3

、焊接制程冷却速度为 2～10℃/sec.

3. Cooling Speed: 2~10

℃/sec.

耐焊接热试验条件 /

Resistance to Soldering Heat Test Conditions

温度：260±5℃

时间：10±1 sec.

Temp.:260±5℃

Time:10±1 sec

包装规格 / Packaging SPEC.

卷盘包装 / REEL

Package Type

封装形式

Units 包装数量

Dimension 包装尺寸 (unit：mm

3)

Units/Reel

只

/卷盘

Reels/Inner Box

卷盘

/盒

Units/Inner Box

只

/盒

Inner Boxes/Outer Box

盒

/箱

Units/Outer Box

只

/箱

Reel

Inner Box 盒

Outer Box 箱

TO-252

2,500

2

5,000

5

25,000

13〞×16

360×360×50

385×257×392

套管包装 / TUBE

Package Type

封装形式

Units 包装数量

Dimension 包装尺寸 (unit：mm

3)

Units/Tube

只

/套管

Tubes/Inner Box

套管

/盒

Units/Inner Box

只

/盒

Inner Boxes/Outer Box

盒

/箱

Units/Outer Box

只

/箱

Tube 套管

Inner Box 盒

Outer Box 箱

TO-251/252

75

48

3,600

5

18,000

526×20.5×5.25

555×164×50

575×290×180

使用说明 / Notices

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