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XDM505XXBABF Datasheet(PDF) 4 Page - Texas Instruments |
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XDM505XXBABF Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 290 page  4 DM505 SPRS976D – NOVEMBER 2016 – REVISED JULY 2017 www.ti.com Submit Documentation Feedback Table of Contents Copyright © 2016–2017, Texas Instruments Incorporated Table of Contents 1 Device Overview ......................................... 1 1.1 Features ............................................. 1 1.2 Applications ........................................... 2 1.3 Description ............................................ 2 1.4 Functional Block Diagram ........................... 3 2 Revision History ......................................... 5 3 Device Comparison ..................................... 6 3.1 Device Comparison Table ............................ 6 4 Terminal Configuration and Functions .............. 8 4.1 Pin Diagram .......................................... 8 4.2 Pin Attributes ......................................... 8 4.3 Signal Descriptions .................................. 39 4.4 Pin Multiplexing ..................................... 65 4.5 Connections for Unused Pins ....................... 76 5 Specifications ........................................... 77 5.1 Absolute Maximum Ratings ......................... 77 5.2 ESD Ratings ........................................ 78 5.3 Power on Hour (POH) Limits ........................ 78 5.4 Recommended Operating Conditions ............... 79 5.5 Operating Performance Points ...................... 81 5.6 Power Consumption Summary ...................... 90 5.7 Electrical Characteristics ............................ 90 5.8 Thermal Characteristics ............................. 96 5.9 Timing Requirements and Switching Characteristics ....................................... 98 6 Detailed Description .................................. 175 6.1 Description ......................................... 175 6.2 Functional Block Diagram ......................... 175 6.3 DSP Subsystem ................................... 176 6.4 IPU ................................................. 181 6.5 EVE ................................................ 182 6.6 Memory Subsystem ................................ 184 6.7 Interprocessor Communication .................... 187 6.8 Interrupt Controller ................................. 188 6.9 EDMA .............................................. 188 6.10 Peripherals ......................................... 190 6.11 On-Chip Debug .................................... 202 7 Applications, Implementation, and Layout ...... 206 7.1 Introduction ........................................ 206 7.2 Power Optimizations ............................... 207 7.3 Core Power Domains .............................. 218 7.4 Single-Ended Interfaces ........................... 227 7.5 Differential Interfaces .............................. 230 7.6 Clock Routing Guidelines .......................... 232 7.7 LPDDR2 Board Design and Layout Guidelines .... 233 7.8 DDR2 Board Design and Layout Guidelines ....... 242 7.9 DDR3 Board Design and Layout Guidelines ....... 254 7.10 CVIDEO/SD-DAC Guidelines and Electrical Data/Timing ........................................ 277 8 Device and Documentation Support .............. 279 8.1 Device Nomenclature .............................. 279 8.2 Tools and Software ................................ 281 8.3 Documentation Support ............................ 281 8.4 Receiving Notification of Documentation Updates . 282 8.5 Community Resources ............................. 282 8.6 Trademarks ........................................ 282 8.7 Electrostatic Discharge Caution ................... 283 8.8 Export Control Notice .............................. 283 8.9 Glossary ............................................ 283 9 Mechanical Packaging Information ............... 284 9.1 Mechanical Data ................................... 284 |
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