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BQ25120AYFPR Datasheet(PDF) 7 Page - Texas Instruments |
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BQ25120AYFPR Datasheet(HTML) 7 Page - Texas Instruments |
7 / 67 page 7 bq25120A www.ti.com SLUSD08 – MAY 2017 Product Folder Links: bq25120A Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 8.4 Thermal Information THERMAL METRIC(1) bq25120A UNIT YFP (DSBGA) 25 PINS RθJA Junction-to-ambient thermal resistance 60 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.3 °C/W RθJB Junction-to-board thermal resistance 12.0 °C/W ψJT Junction-to-top characterization parameter 1.2 °C/W ψJB Junction-to-board characterization parameter 12.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W |
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