 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
RT9526AGE Datasheet(PDF) 11 Page - Richtek Technology Corporation |
|
||||||||||||||||||||||||||||||
RT9526AGE Datasheet(HTML) 11 Page - Richtek Technology Corporation |
|
|
11 / 13 page  RT9526A 11 DS9526A-03 July 2014 www.richtek.com © Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. Figure 4. PCB Layout Guide Layout Consideration The RT9526A is a fully integrated low cost single-cell Li- ion battery charger ideal for portable applications. Careful PCB layout is necessary. For best performance, place all peripheral components as close to the IC as possible. A short connection is highly recommended. The following guidelines should be strictly followed when designing a PCB layout for the RT9526A. Input capacitor should be placed close to the IC and connected to the ground plane. The trace of input on the PCB should be placed far away from the sensitive devices and shielded by the ground. The GND and exposed pad should be connected to a strong ground plane for heat sinking and noise protection. The connection of RISET should be isolated from other noisy traces. Output capacitor should be placed close to the IC and connected to the ground plane to reduce noise coupling. Figure 3. Derating Curve of Maximum Power Dissipation ISET VIN ENB PGB BATT GND CHG_SB 7 6 5 1 2 3 4 8 9 IMIN BATT BATT VIN BATT COUT CIN R1 R2 RISET RIMIN GND CIN should be placed near the IC to improve performance. The copper area connecting the resistors of ISET and IMIN should be minimized and kept far away from noise sources. The GND plane should be connected to a strong ground plane for heat sinking and noise protection. PD(MAX) = (125 °C − 25°C) / (31.5°C/W) = 3.17W for WDFN-8L 2x3 package PD(MAX) = (125 °C − 25°C) / (208.2°C/W) = 0.48W for SOT-23-6 package The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, θJA. The derating curve in Figure 3 allow the designer to see the effect of rising ambient temperature on the maximum power dissipation. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 Ambient Temperature (°C) Four-Layer PCB WDFN-8L 2x3 SOT-23-6 |
Similar Part No. - RT9526AGE |
|
Similar Description - RT9526AGE |
|
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.COM |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
