NCV7430

www.onsemi.com

4

Pin #

Label

Pin Description

1

ANODE

Anode input for LED fault detection

2

VBIAS

Bias output for ballast transistor

3

VBB

VBB (14 V) Supply Voltage

4

LIN

LIN−bus connection

5

GND

Supply GND

6

TST2

Test pin (ground pin)

7

GND

Supply GND

8

LED3R

Current program resistor to ground for LED3C

9

LED1R

Current program resistor to ground for LED1C

10

LED2R

Current program resistor to ground for LED2C

11

TST1

Test pin (float pin) (Note 1)

12

LED2C

Channel 2 regulated current output to LED cathode

13

LED1C

Channel 1 regulated current output to LED cathode

14

LED3C

Channel 3 regulated current output to LED cathode

1. Floating pin 11 eliminates the possibility of a short to ground of the adjacent pin (LED2C).

Table 3. MAXIMUM RATINGS

Parameter

Min

Max

Unit

Supply voltage

−0.3

+43 (Note 2)

V

Supply voltage

−0.3

28 (Note 3)

V

Vlin

Bus input voltage (LIN)

−45

+45

V

VVBIAS

Ballast Transistor Drive Voltage Pin (VBIAS)

−0.3

VANODE

V

IBIAS

Ballast Output Drive (VBIAS)

−

10

mA

VANODE

LED Fault Sense Pin (ANODE) voltage

−0.3

VBB

V

VLEDC

LED Current Pin (LEDxC) voltage (Note 7)

−0.3

VBB

V

VLEDR

Program Current Pin (LEDxR) voltage (Note 4)

−0.3

3.6

V

Junction temperature range (Note 5)

−50

+175

°C

Tflw

Peak Reflow Soldering Temperature: Pb−Free

60 to 150 seconds at 217

°C (Note 6)

−

260 peak

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

2. For limited time: t < 0.5 s.

3. t < 3 minutes

4. VLEDR cannot exceed VLEDC.

5. The circuit functionality is not fully guaranteed outside operating temperature range.

6. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D,

and Application Note AND8003/D.

7. Capacitive loading on LEDxC pins is limited to < 200 pF for proper functionality.

Table 4. ATTRIBUTES

Characteristics

Value

ESD Capability

Human Body Model (LIN Pin)

(Note 8)

Human Body Model (All Remaining Pins)

Machine Model

>

± 4 kV

>

± 2 kV

>

± 200 V

Moisture Sensitivity Level (Note 6)

MSL 2

Storage Temperature

−55

°C to 150°C

Package Thermal Resistance

100

°K/W

53

°K/W

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

8. HBM according to AEC−Q100: EIA−JESD22−A114−B (100 pF via 1.5 k

W) and MM according to AEC−Q100: EIA−JESD22−A115−A.

9. Simulated conform JEDEC JESD51