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MAX8559ETA Datasheet(PDF) 8 Page - Maxim Integrated Products |
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MAX8559ETA Datasheet(HTML) 8 Page - Maxim Integrated Products |
8 / 12 page Load-Transient Considerations The MAX8559 load-transient response graphs (see the Typical Operating Characteristics) show two compo- nents of the output response: a DC shift in the output voltage due to the different load currents and the tran- sient response. Typical overshoot for step changes in the load current from 10µA to 100mA is 15mV. Increase the output capacitor’s value and decrease its ESR to attenuate transient spikes. Dropout Voltage A regulator’s minimum input-output voltage differential (or dropout voltage) determines the lowest usable sup- ply voltage. In battery-powered systems, this determines the useful end-of-life battery voltage. Because the MAX8559 uses an internal P-channel MOSFET pass transistor, its dropout voltage is a function of the drain- to-source on-resistance (RDS(ON)) multiplied by the load current (see the Typical Operating Characteristics). Calculating the Maximum Output Power in UCSP The maximum output power of the MAX8559 is limited by the maximum power dissipation of the package. By calculating the power dissipation of the package as a function of the input voltage, output voltages, and out- put currents, the maximum input voltage can be obtained. The maximum power dissipation should not exceed the package’s maximum power rating. P = (VIN(MAX) - VOUTA) x IOUTA + (VIN(MAX) - VOUTB) x IOUTB where: VIN(MAX) = maximum input voltage PMAX = maximum power dissipation of the package (379mW for the UCSP and 1951mW for the TDFN) VOUTA = output voltage of OUTA VOUTB = output voltage of OUTB IOUTA = maximum output current of OUTA IOUTB = maximum output current of OUTB P should be less than PMAX. If P is greater than PMAX, consider the TDFN. Layout Guidelines Due to the low output noise and tight output voltage accuracy required by most applications, careful PC board layout is required. An evaluation kit (MAX8559EVKIT) is available to speed design. Follow these guidelines for good PC board layout: • Keep the input and output paths short and wide if possible, especially at the ground terminals. • Use thick copper PC boards (2oz vs. 1oz) to enhance thermal capabilities. • Place output, input, and bypass capacitors as close as possible to the IC. • Ensure traces to BP and the BP capacitor are away from noisy sources to ensure low output voltage noise. Dual, 300mA, Low-Noise Linear Regulator with Independent Shutdown in UCSP or TDFN 8 _______________________________________________________________________________________ |
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