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MAX3861E Datasheet(PDF) 8 Page - Maxim Integrated Products |
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MAX3861E Datasheet(HTML) 8 Page - Maxim Integrated Products |
8 / 13 page Select the Coupling Capacitors When AC-coupling is desired, coupling capacitors CIN and COUT should be selected to minimize the receiv- er’s deterministic jitter. Jitter is decreased as the input low-frequency cutoff (fIN) is decreased. For ATM/SONET or other applications using scrambled NRZ data, select (CIN, COUT) ≥ 0.1µF, which provides fIN < 32kHz. For Fibre Channel, Gigabit Ethernet, or other applications using 8B/10B data coding, select (CIN, COUT) ≥ 0.01µF, which provides fIN <320kHz. Setting the Offset-Cancellation Loop Time Constant for Input Signal Detection Circuitry (Selecting CCD) The capacitor between CD+ and CD- determines the time constant of the input signal detection DC offset- cancellation loop. A value of 0.1µF for CCD provides a low-frequency cutoff (fC) below 10kHz. If a lower cutoff frequency is desired, 0.22µF gives fC = 4.5kHz and 0.47µF gives fC = 2.1kHz. To guarantee stable opera- tion, a capacitor of less than 0.01µF should not be used. Setting the Offset-Cancellation Loop Time Constant for the Main Signal Path (Selecting CCZ) The capacitor between CZ+ and CZ- determines the time constant of the signal path DC offset-cancellation loop. To maintain stability, it is important to keep a one- decade separation between fIN and the low-frequency cutoff (fOC) associated with the DC offset-cancellation circuit. For SONET applications, fIN < 32kHz, so fOCMAX < 3.2kHz. Therefore, CCZ = 0.22µF (fOC = 2.99kHz), CCZ = 0.47µF (fOC = 1.4kHz), or a greater value may be used.To guarantee stable operation, a capacitor of less than 0.01µF should not be used. Setting the Automatic Gain-Control Loop Time Constant (Selecting CCG) The automatic gain-control loop time constant is deter- mined by the external capacitor connected between CG+ and CG-. A value of at least 0.0022µF is recommended Programming the Output Amplitude (Programming the SC Pin) Output amplitude can be programmed from 400mVP-P to 920mVP-P by applying a voltage to the SC pin. See Output Signal Amplitude vs SC Pin Voltage in the Typical Operating Characteristics. Applications Information Wire Bonding Die For high current density and reliable operation, the MAX3861 uses gold metallization. Make connections to the dice with gold wire only, and use ball-bonding tech- niques (wedge bonding is not recommended). The MAX3861 has two types of bond pads: the dimensions for square bondpads are 94.4 microns by 94.4 microns; the dimensions for the octagonal bondpads are 33.6 microns per side. Die thickness is 12mils (0.305mm). f C IN IN = ()( ) [] 1 250 π 2.7Gbps Post Amp with Automatic Gain Control 8 _______________________________________________________________________________________ |
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