4

TLV743P

SBVS310 – JULY 2017

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6 Specifications

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted); all voltages are with respect to GND

(1)

MIN

MAX

UNIT

Voltage

–0.3

6

V

–0.3

–0.3

3.6

Current

Internally limited

A

Output short-circuit duration

Indefinite

Temperature

–40

150

°C

–65

160

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input range

1.4

5.5

V

Output range

1

3.3

V

Output current

0

300

mA

Enable range

0

V

Junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TLV743P

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

228.4

°C/W

Junction-to-case (top) thermal resistance

151.5

°C/W

Junction-to-board thermal resistance

55.8

°C/W

Junction-to-top characterization parameter

31.4

°C/W

Junction-to-board characterization parameter

54.8

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W