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TLE2037Y Datasheet(PDF) 1 Page - Texas Instruments |
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TLE2037Y Datasheet(HTML) 1 Page - Texas Instruments |
1 / 45 page TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS SLOS192C − FEBRUARY 1997 − REVISED APRIL 2010 1 D Outstanding Combination of dc Precision and AC Performance: Unity-Gain Bandwidth...15 MHz Typ Vn 3.3 nV/√Hz at f = 10 Hz Typ, . . . . . 2.5 nV/√Hz at f = 1 kHz Typ VIO 25 μV Max . . . . AVD 45 V/μV Typ With RL = 2 kΩ, . . . . 19 V/μV Typ With RL = 600 Ω D Available in Standard-Pinout Small-Outline Package D Output Features Saturation Recovery Circuitry D Macromodels and Statistical information description The TLE20x7 and TLE20x7A contain innovative circuit design expertise and high-quality process control techniques to produce a level of ac performance and dc precision previously unavail- able in single operational amplifiers. Manufac- tured using Texas Instruments state-of-the-art Excalibur process, these devices allow upgrades to systems that use lower-precision devices. In the area of dc precision, the TLE20x7 and TLE20x7A offer maximum offset voltages of 100 μV and 25 μV, respectively, common-mode rejection ratio of 131 dB (typ), supply voltage rejection ratio of 144 dB (typ), and dc gain of 45 V/μV (typ). AVAILABLE OPTIONS PACKAGED DEVICES CHIP TA VIOmax AT 25 °C SMALL OUTLINE† (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) CHIP FORM‡ (Y) 0 °C to 70°C 25 μV TLE2027ACD TLE2037ACD — — — — TLE2027ACP TLE2037ACP TLE2027Y TLE2037Y 0 °C to 70°C 100 μV TLE2027CD TLE2037CD — — — — TLE2027CP TLE2037CP TLE2027Y TLE2037Y 40 °C to 105°C 25 μV TLE2027AID TLE2037AID — — — — TLE2027AIP TLE2037AIP — −40 °C to 105°C 100 μV TLE2027ID TLE2037ID — — — — TLE2027IP TLE2037IP — 55 °C to 125°C 25 μV TLE2027AMD TLE2037AMD TLE2027AMFK TLE2037AMFK TLE2027AMJG TLE2037AMJG TLE2027AMP TLE2037AMP — −55 °C to 125°C 100 μV TLE2027MD TLE2037MD TLE2027MFK TLE2037MFK TLE2027MJG TLE2037MJG TLE2027MP TLE2037MP — † The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2027ACDR). ‡ Chip forms are tested at 25°C only. Copyright © 2002−2006, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. www.ti.com 1 2 3 4 8 7 6 5 OFFSET N1 IN − IN + VCC − OFFSET N2 VCC + OUT NC D, JG, OR P PACKAGE (TOP VIEW) 3 2 1 20 19 910 11 12 13 4 5 6 7 8 18 17 16 15 14 NC VCC+ NC OUT NC NC IN− NC IN+ NC FK PACKAGE (TOP VIEW) |
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