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OPA196, OPA2196, OPA4196

www.ti.com

SBOS869 – JULY 2017

Product Folder Links: OPA196 OPA2196 OPA4196

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Short-circuit to ground, one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

±20

(+40, single supply)

V

Signal input pins

Voltage

Common-mode

(V–) – 0.5

(V+) + 0.5

V

Differential

(V+) – (V–) + 0.2

Current

±10

mA

Continuous

Continuous

Continuous

Temperature

Operating

–40

150

°C

Junction

150

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

OPAx196

±3000

V

Electrostatic

discharge

OPA196

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

V

OPA2196

±500

V

OPA4196

±500

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

4.5 (±2.25)

36 (±18)

V

Specified temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA196

OPA196

UNIT

8 PINS

5 PINS

D (SOIC)

DGK

(VSSOP)

DBV (SOT)

Junction-to-ambient thermal resistance

115.8

180.4

158.8

°C/W

Junction-to-case(top) thermal resistance

60.1

67.9

60.7

°C/W

Junction-to-board thermal resistance

56.4

102.1

44.8

°C/W

Junction-to-top characterization parameter

12.8

10.4

1.6

°C/W

Junction-to-board characterization parameter

55.9

100.3

4.2

°C/W

Junction-to-case(bottom) thermal resistance

N/A

N/A

N/A

°C/W