Electronic Components Datasheet Search |
|
OPA196ID Datasheet(PDF) 5 Page - Texas Instruments |
|
|
OPA196ID Datasheet(HTML) 5 Page - Texas Instruments |
5 / 47 page 5 OPA196, OPA2196, OPA4196 www.ti.com SBOS869 – JULY 2017 Product Folder Links: OPA196 OPA2196 OPA4196 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Short-circuit to ground, one amplifier per package. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VS = (V+) – (V–) ±20 (+40, single supply) V Signal input pins Voltage Common-mode (V–) – 0.5 (V+) + 0.5 V Differential (V+) – (V–) + 0.2 Current ±10 mA Output short circuit(2) Continuous Continuous Continuous Temperature Operating –40 150 °C Junction 150 Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge OPAx196 Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V V(ESD) Electrostatic discharge OPA196 Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 V OPA2196 ±500 V OPA4196 ±500 V 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage, VS = (V+) – (V–) 4.5 (±2.25) 36 (±18) V Specified temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information: OPA196 THERMAL METRIC(1) OPA196 UNIT 8 PINS 5 PINS D (SOIC) DGK (VSSOP) DBV (SOT) RθJA Junction-to-ambient thermal resistance 115.8 180.4 158.8 °C/W RθJC(top) Junction-to-case(top) thermal resistance 60.1 67.9 60.7 °C/W RθJB Junction-to-board thermal resistance 56.4 102.1 44.8 °C/W ψJT Junction-to-top characterization parameter 12.8 10.4 1.6 °C/W ψJB Junction-to-board characterization parameter 55.9 100.3 4.2 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A N/A °C/W |
Similar Part No. - OPA196ID |
|
Similar Description - OPA196ID |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |